Mainkco IPC ABOX-2130-603 is using NVIDIA Jetson Xavier NX system of modules (SOM) based on our ABOX-2130 model modular AI edge computing family. Its computing capacity can be up to 21 TOPS of accelerated computing power to run modern neural networks and process data from multiple high-resolution sensors to meet the requirements of a complete AI system. The ABOX-2130-603 AI edge computing PC is designed with rich IO interfaces for industrial and automation applications, including 3 GLAN, 4 USB3.0, 1 HDMI display…
AI edge computing with NVIDIA Jetson Xavier NX platform AI system ABOX-2130-603
Key features:
Ø 6-Core NVIDIA Carmel Arm v8.2 64-bit CPU 6MB L2 + 4MB L3 processor;
Ø 384 core NVIDIA Volta GPU with 48 Tensor Core, 1100 Mhz;
Ø AI performance 21 TOPS;
Ø On-board 8GB memory, On-board 16GB eMMc, 1* M.2 Key-M 2280 SSD slot, 1* TF card slot;
Ø 3*GLAN, 4*USB3.0, 1*HDMI, 2* RS232/RS485, DC, OTG;
Ø Support 5G/4G/Wi-Fi, 1*M.2 B-key 3042/3052 slot, 1*Mini-PCIe slot, 2* Nano Sim card slot;
Ø DC 12~28V power input, industrial operating temp. -20 ~ +60 ℃;
Ø Support Desktop mount and DIN-Rail mount.
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SKU:
ABOX-2130-603
Category: AI Edge Computing
Tags: NVIDIA Jetson Xavier NX AI system, AI System, Box PC, AI Edge computing Box PC, Edge computing, AI edge computing, GeForce, Cambricon, Smart industries, NVIDIA Carmel ARM platform
Description
Technical Data
Technical Data
System | |
Processor | 6-core NVIDA Carmel ARM v8.2 64-bit processor, 6MB L2 + 4MB L3, up to 1.9Ghz |
AI | 21 TOPS |
GPU | 1100 Mhz |
384-core NVIDA Volta GPU with 48 Tensor Cores | |
Display | 1* HDMI (Type-A): Max. resolution up to 4K @60Hz |
Memory | Onboard 8GB 128bit LPDDR4x 59.7GB/s |
Storage | 16GB eMMC 5.1, 1* M.2 2280 Key-M slot (NVMe, PCIe x1), 1* TF card slot |
Network | 1* GbE LAN (From SOM), 2* Intel I210AT GbE LAN |
USB | 4* USB3.0 (Type-A), 1*USB2.0(Internal, wafer), 1* Micro-USB (OTG) |
COM | 2* RS232/RS485 (COM1/2, Wafer, jumper switch); 1* RS232/TTL (COM3, wafer, jumper switch) |
Audio | ES8336 Audio chip (internal, wafer) |
GPIO | 16 bits DIO (8* DI and 8*DI, Internal, wafer) |
CAN | 1* CAN-Bus (Internal, wafer) |
DC | DC 12~28V (1* 2Pin Terminal) |
Expansion | 1* Mini-PCIe slot (PCIe x1, USB2.0) |
1* M.2 B-key 3042/3052 slot (USB3.0 + USB2.0) | |
2* Nano SIM Card | |
Button/LED | 1* Power button, with LED light |
1* Recovery Button | |
1* System Reset Button | |
OS | JetPack 4.6.3 |
Structure | |
Treatment | SGCC & Aluminum Alloy, Anodizing and painting |
Color | Iron Grey |
Cooling | PWM Fan |
Weight | Around 1.5 kg (Net weight) |
Dimension | 150.7mmx 144.5mm x 45mm (Fan not included) |
Mounting | Desktop, Din-Rail |
Environmental | |
Operation temp. | Operating temp.: -20~60°C (with 0.7m/s airflow) |
Storage | -40~80°C |
Humidity | 10%~95%@40°C, non-condensation |
Vibration | 3Grms@5~500Hz,random,1 hr/axis (IEC-60068-2-64); |
Shock | 10G, half sine, 11ms sec (IEC 60068-2-27) |
Product Dimension
Product Dimension
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